TANK-820-H61
[Modell-Nr.:TANK-820-H61]
TANK-820-H61
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Fanless Intel®  Sandy Bridge 3-Slot Embedded System
- 2nd Generation Intel® Core™ low power desktop processors
- On-board 2GB DDR3 memory and one DDR3 SO-DIMM slot (system max. 10GB)
- Redundant dual wide range DC power support (9 V~24 V DC)

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Embedded-PC Barebones
Individualisierung
Betriebssystem
Installieren und Anpassen

Hardware-Integration
Industrie-PC Ready-To-Use

Software-Integration
Das Rundum-sorglos-Paket

BIOS-Anpassung
Optimal Settings werden Default Settings

Design-Anpassung
Innen wie außen komplett nach Ihren Vorgaben

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Name Beschreibung Status Preis in € * Datenblatt Aktion
TANK-820-H61-i5/2G/1P2E-R22 Fanless Extend temperature embedded syst with One PCIe x1 and one PCIe x 8 and one PCI expansion, Core i5 Dual Core 2xxT CPU (Above 2.7 GHz), TDP 35W, Dual 9 V-24 V DC-IN, 2GB DDR3 Memory on-board, -20°C ~ 60°C [Preisinfo nur für User]
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TANK-820-H61-P/2G/2P1E-R22 Fanless Extend temperature embedded syst with One PCIe x8 and two PCI expansion, Pentium Dual Core G6xxT CPU (Above 2.2 GHz), TDP 35W, Dual 9 V-24 V DC-IN, 2GB DDR3 Memory on-board, -20°C ~ 60°C [Preisinfo nur für User]
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TANK-820-H61-P/2G/1P2E-R22 Fanless Extend temperature embedded syst with One PCIe x1 and one PCIe x 8 and one PCI expansion, Pentium Dual Core G6xxT CPU(Above 2.2 GHz), TDP 35W, Dual 9 V-24 V DC-IN, 2GB DDR3 Memory on-board, -20°C ~ 60°C [Preisinfo nur für User]
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TANK-820-H61-i3/2G/2P1E-R22 Fanless Extend temperature embedded syst with One PCIe x8 and two PCI expansion, Core i3 Dual Core 2xxT CPU (Above 2.5 GHz), TDP 35W, Dual 9 V-24 V DC-IN, 2GB DDR3 Memory on-board, -20°C ~ 60°C [Preisinfo nur für User]
Add to Cart
TANK-820-H61-i3/2G/1P2E-R22 Fanless Extend temperature embedded syst with One PCIe x1 and one PCIe x 8 and one PCI expansion, Core i3 Dual Core 2xxT CPU (Above 2.5 GHz), TDP 35W, Dual 9 V-24 V DC-IN, 2GB DDR3 Memory on-board, -20°C ~ 60°C [Preisinfo nur für User]
Add to Cart
TANK-820-H61-i5/2G/2P1E-R22 Fanless Extend temperature embedded syst with One PCIe x8 and two PCI expansion, Core i5 Dual Core 2xxT CPU (Above 2.7 GHz), TDP 35W, Dual 9 V-24 V DC-IN, 2GB DDR3 Memory on-board, -20°C ~ 60°C [Preisinfo nur für User]
Add to Cart
TANK-820-H61-i3/2G/1P2E-R10/36 Monate Gewährleistung Extend temperature embedded system with One PCIe x1 and one PCIe x 8 and one PCI expansion, Core i3 Dual Core 2xxT CPU (Above 2.5GHz), TDP 35W, Dual 9-24V DC-IN, 2GB DDR3 Memory on-board,-20°C~60°C, R10, mit Gewährleistung 36 Monate
TANK-820-H61/2G/1P2E-R10 Extend temperature fanless embedded system with One PCIe x1 and one PCIe x 8 and one PCI expansion, Dual 9-24V DC-IN, 2GB DDR3 Memory on-board,-20°C~60°C, R10
TANK-820-H61-i5/2G/1P2E-R21 Extend temperature embedded system with One PCIe x1 and one PCIe x 8 and one PCI expansion,Core i5 Dual Core 2xxT CPU (Above 2.7GHz),TDP 35W,Dual 9-24V DC-IN,2GB DDR3 Memory on-board,-20°C~60°C
TANK-820-H61-i5/2G/1P2E-R20 Extend temperature embedded system with One PCIe x1 and one PCIe x 8 and one PCI expansion,Core i5 Dual Core 2xxT CPU (Above 2.7GHz),TDP 35W,Dual 9-24V DC-IN,2GB DDR3 Memory on-board,-20°C~60°C
TANK-820-H61-i5/2G/2P1E-R10 Extend temperature embedded system with One PCIe x8 and two PCI expansion, Core i5 Dual Core 2xxT CPU (Above 2.7GHz), TDP 35W, Dual 9-24V DC-IN, 2GB DDR3 Memory on-board, -20°C~60°C,R10
TANK-820-H61-i5/2G/1P2E-R10 Extend temperature embedded system with One PCIe x1 and one PCIe x 8 and one PCI expansion, Core i5 Dual Core 2xxT CPU (Above 2.7GHz), TDP 35W, Dual 9-24V DC-IN, 2GB DDR3 Memory on-board,-20°C~60°C, R10
TANK-820-H61-i3/2G/1P2E-R10 Extend temperature embedded system with One PCIe x1 and one PCIe x 8 and one PCI expansion, Core i3 Dual Core 2xxT CPU (Above 2.5GHz), TDP 35W, Dual 9-24V DC-IN, 2GB DDR3 Memory on-board,-20°C~60°C, R10
TANK-820-H61-i3/2G/2P1E-R10 Extend temperature embedded system with One PCIe x8 and two PCI expansion, Core i3 Dual Core 2xxT CPU (Above 2.5GHz), TDP 35W, Dual 9-24V DC-IN, 2GB DDR3 Memory on-board, -20°C~60°C,R10
Color Black C + Silver
Dimensions (WxDxH) 133 mm x 269 mm x 208 mm
System Fan Fanless
Chassis Construction Extruded aluminum alloys
System Memory On-board DDR3 2 GB memory
1 x 204-pin DDR3 SO-DIMM (system max: 10 GB)
Hard Drive 1 x 2.5\ SATA 3Gb/s HDD/SSD bay
CompactFlash® 1 x CF Type II
USB 3.0 2
USB 2.0 4
RS-232 4 x DB-9 (two with isolation)
RS-422/485 2 x RJ-45
Display 1 x VGA, 1 x DVI-I
Resolution VGA: Up to 2048 x 1536@75Hz
DVI-I: Up to 1920 x 1080@60Hz
PCI 2P1E: 2 x PCI, 1P2E: 1 x PCI
PCIe 2P1E: One PCIe x 8 (physical PCIe x 16 slot)
1P2E: One PCIe x 1 (physical x 4 slot),
One PCIe x 8 (physical x 16 slot)
Power input Terminal Block: 9 V~24 V DC
DC Jack: 9 V~24 V DC
Operating Temperature -20°C ~ 60°C with air flow (SSD),
5% ~ 95%, non-condensing
Operating Shock Half-sine wave shock 5G, 11ms, 3 shocks per axis
Operation Vibration MIL-STD-810F 514.5C-2 (with SSD)
Weight (Net / Gross) 4.2 kg/6.3 kg
Safety / EMC CE/FCC
Supported OS Microsoft® Windows® Embedded Standard 7 E
Microsoft® Windows® XP Embedded
PDF Datenblatt
Bild im Großformat