TANK-870-Q170i-i5/4G/2B-R11

Ruggedized fanless embedded system with Intel® Core™ i5-6500TE 2.3 GHz (up to 3.3 GHz, quad core, TDP 35W), 4GB DDR4 preinstalled memory, 1 x PCIe by 16 & 1 x PCI expansion, VGA/HDMI+DP/iDP, iRIS-2400 optional, 9~36V DC, RoHS

  • 6th/7th Gen Intel® Core™ processor platform with Intel® Q170 chipset and DDR4 memory
  • Triple independent display with high resolution support
  • Rich high-speed I/O interfaces on one side for easy installation
  • On-board internal power connector for providing power to add-on cards
  • Great flexibility for hardware expansion
Artikelnummer: 506470

Spezifikationen TANK-870-Q170i-i5/4G/2B-R11

ColorBlack C + Silver
Dimensions (WxDxH) (mm)2-slot: 121.5 x 255.2 x 205
System FanFanless
Chassis ConstructionExtruded aluminum alloys
CPUIntel 7th Gen Core CPU & Intel® Core™ i5-6500TE (2.3 GHz, quad-core, TDP=35W)
ChipsetIntel® Q170
System Memory2 x 260-pin DDR4 SO-DIMM, one 4 GB pre-installed (system max: 64GB)
iRIS Solution1 x iRIS-2400 (optional)
Hard Drive2 x 2.5'' SATA 6Gb/s HDD/SSD bay (RAID 0/1 support)
USB 3.04
USB 2.04
Ethernet2 x RJ-45
LAN1: Intel® I219LM PCIe controller
LAN2 (iRIS): Intel® I210 PCIe controller
COM Port4 x RS-232 (2 x RJ-45, 2 x DB-9 w/2.5KV isolation protection)
2 x RS-232/422/485 (DB-9)
Digital I/O8-bit digital I/O , 4-bit input / 4-bit output
Display1 x VGA
1 x HDMI/DP
1 x iDP (optional)
ResolutionVGA: Up to 1920 x 1200@60Hz
HDMI/DP: Up to 4096×2304@60Hz
Audio1 x Line-out, 1 x Mic-in
Wireless1 x 802.11 a/b/g/n/ac (optional)
TPM1 x TPM pin header (2 x 10 pin)
Backplane2-slot model: 1 x PCIe x16, 1 x PCI
PCIe Mini1 x Half-size PCIe Mini slot
1 x Full-size PCIe Mini slot (supports mSATA, colay with SATA)
Power InputDC Jack: 9 V~36 V DC
Terminal Block: 9 V~36 V DC
Power Consumption19 V@3.68 A (Intel® Core™ i7-6700TE with 8 GB memory)
Internal Power output5V@3A or 12V@3A
MountingWall mount
Operating Temperaturei7-6700TE -20°C ~ 45°C with air flow (SSD), 10% ~ 95%, non-condensing
i5-6500TE -20°C ~ 60°C with air flow (SSD), 10% ~ 95%, non-condensing
Storage Temperature-40°C ~85°C with air flow (SSD), 10% ~ 90%, non-condensing
Operating ShockHalf-sine wave shock 5G, 11ms, 100 shocks per axis
Operating VibrationMIL-STD-810G 514.6 C-1 (with SSD)
Weight (Net/Gross)2-slot: 4.2 kg/6.3 kg
Safety/EMCCE/FCC
Supported OSMicrosoft® Windows® 8 Embedded, Microsoft® Windows® Embedded Standard 7 E, Microsoft® Windows® 10 IoT Enterprise
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Statusregular

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