DX-1100
Lüfterloser Embedded PC mit 9. Gen. Intel® Xeon oder Core oder 8. Gen. Intel® Xeon, Core, Pentium oder Celeron Prozessor. 2666/2400 MHz DDR4 RAM bis zu 64 GB möglich. Betriebstemperatur abhängig vom Prozessor, bei 35W TDP zwischen -40°C und 70°C. Die Abmessungen des Embedded PC betragen 242 x 173 x 77 mm. Massenspeicherung mit 2,5 Zoll SATA HDD/SSD, von der Frontseite aus zugänglich und mit RAID 0/1/5/10-Unterstützung. Außerdem mSATA. Der Embedded PC ist zertifiziert für Railway mit EN50155 und EN50121-3-2 und für Vehicle mit E-Mark. Displays werden mit DVI-I, DisplayPort und HDMI angeschlossen. Netzwerkanbindung mit GbE LAN und Funk (SIM-Karten-Slot). Weitere Schnittstellen sind USB 3.0, USB 3.1, RS-232/422/485, Line-out und Mic-in. Erweiterbar durch Mini-PCIe, M.2 2230 E-Key für WLAN und Bluetooth, CFM-Modul, und CMI-Module.
- Supports 8th Gen Intel® Xeon® and Core™ Hexa-core Processor
- Triple Independent Display with 4K/2K UHD Resolution (HDMI / DP / DVI-I)
- 2x 2.5" Hot Swap SATA HDD/SSD Tray, 3x mSATA Socket
- 2x USB 3.1 (10Gb/s) for Ultimate Data-transfer Speed
- 1x M.2 E Key Socket (CNVi), 3x Full-size Mini-PCIe, 1x SIM Card Socket
- Supports CMI Interface for I/O Expandability
- Supports PoE+ and Power Ignition Sensing (with optional CFM modules)
- Wide Operating Temperature -40°C to 70°C
- E-Mark (E13 Pending), LVD EN60950-1 (Pending), EN50155 / EN50121-3-2
Hauptmerkmale
Spezifikationen| Processor | Intel® Xeon® E-2176G Hexa Core up to 4.7 GHz - 12M Cache, TDP 80W Intel® Xeon® E-2124G Quad Core up to 4.5 GHz - 8M Cache, TDP 71W Intel® Core™ i7-8700 Hexa Core up to 4.6 GHz - 12M Cache, TDP 65W Intel® Core™ i5-8500 Hexa Core, up to 4.1 GHz - 9M Cache, TDP 65W Intel® Core™ i3-8100 Quad Core 3.6 GHz - 6M Cache, TDP 65W Intel® Core™ i7-8700T Hexa Core up to 4.0 GHz - 12M Cache, TDP 35W Intel® Core™ i5-8500T Hexa Core up to 3.5 GHz - 9M Cache, TDP 35W Intel® Core™ i3-8100T Quad Core 3.1 GHz - 6M Cache, TDP 35W Intel® Pentium® G5400 Dual Core 3.7 GHz - 4M Cache, TDP 58W Intel® Pentium® G5400T Dual Core 3.1 GHz - 4M Cache, TDP 35W Intel® Celeron® G4900 Dual Core 3.1 GHz - 2M Cache, TDP 54W Intel® Celeron® G4900T Dual Core 2.9 GHz - 2M Cache, TDP 35W |
| Chipset | Intel C246 |
| Memory | 2x DDR4-2666/2400 MHz SO-DIMM Sockets Support up to 32 GB (Un-buffered and Non-ECC type) i3/Pentium/Celeron: DDR4 2400 MHz |
| Graphics | Integrated Intel® UHD Graphics Xeon: UHD P630 i7/i5/i3: UHD 630 Pentium/Celeron: UHD 610) |
| Audio | Realtek® ALC888, High Definition Audio |
| BIOS | AMI 32 MB BIOS |
| DVI | 1x DVI-I Connector (1920 x1200 @ 60 Hz) |
| DP | 1x DisplayPort Connector (3840 x 2160 @30Hz) |
| HDMI | 1x HDMI Connector (3840 x 2160 @30Hz) |
| LAN | 2x GbE LAN (Support WoL, Teaming, Jumbo Frame, IEEE 1588v2 and PXE), RJ45 GbE1: Intel® I219-LM GbE2: Intel® I210-IT Optional Module 4x 10/100/1000 Mbps, RJ45 Port or 4x 10/100/1000 Mbps, M12 Port |
| PoE+ | Optional Module 4x PoE+, Individual port 25.5W (with CMI-LAN01, RJ45 Port) 4x PoE+, Individual port 25.5W, (with CMI-M12LAN01, M12 Port) |
| Serial Port | 4x RS-232/422/485 with Auto Flow Control Support 5V/12V, DB9 Optional Module 2x RS-232/422/485, DB9 Connector |
| USB | 2x USB 3.1 (Type-A) 6x USB 3.0 (Type-A) |
| Optical Isolated DIO | Optional Module 16x Optical Isolated DIO(8DI, 8DO), 20 pin Terminal Block |
| Line-Out | 1x Line-Out, Phone Jack 3.5mm |
| Mic-In | 1x Mic-In, Phone Jack 3.5mm |
| Power Button | 1x ATX Power On/Off Button |
| AT/ATX Switch | 1x AT/ATX Mode Switch |
| Rest Button | 1x Rest Button |
| Clear CMOS Switch | 1x Clear CMOS Switch |
| Remote Power On/Off Connector | 1x Remote Power On/Off Connector, 2-pin Terminal Block |
| External FAN Connector | 1x External FAN Connector, 4-pin Terminal Block (support smart fan by BIOS) |
| SSD/HDD | 2x 2.5" Front Accessable SATA HDD/SSD Bay (SATA 3.0) |
| mSATA | 3x mSATA Socket (SATA 3.0, shared by Mini-PCIe socket) |
| RAID | Supports S/W RAID 0, 1, 5 & 10 |
| PCI/ PCIe | - |
| CFM (Control Function Module) Interface | 1x CFM Interface for CFM Modules |
| CMI (Combine Multiple I/O) Interface | 3x CMI Interface for CMI Modules |
| Mini PCI Express | 3x Full-size Mini-PCIe Sockets |
| M.2 Socket | 1x M.2 2230 Socket (Key E) |
| SIM Socket | 1x SIM Socket |
| Antenna Holes | 3x Antenna Holes |
| Instant Reboot | Support 0.2sec |
| Power Ignition Sensing | Optional Module CFM with Delay Time Management and Selectable 12V/24V, Dip Switch |
| Super Cap | SuperCap Integrated for CMOS Battery Maintenance-free Operation |
| Watchdog Timer | Software Programmable Supports 256 Levels System Reset |
| Power Type | AT/ATX |
| Power Input Voltage | 9~48VDC |
| Power Connector | 3-pin Terminal Block |
| Power Adapter | Optional AC/DC Adapter AC/DC 24V/5A, 120W or AC/DC 24V/9.2A, 220W |
| Dimension (WxDxH) | 242 x 174 x 77 mm |
| Weight Information | 3.6 kg |
| Mechanical Construction | Extruded Aluminum with Heavy Duty Metal |
| Mounting | Wall / VESA / DIN Rail / Side |
| Unibody Design | Yes |
| Fanless Design | Yes |
| Jumper-less Design | Yes |
| Cable-less Design | Yes |
| Reverse Power Input Protection | Yes |
| Over Voltage Protection | 58V |
| Over Current Protection | 15A |
| ESD Protection | +/-15kV(Air), +/-8kV(Contact) |
| Surge Protection | 3.84 kV (impedance 12 ohm 1.2/50us waveform) |
| Operating System | Windows® 10 Linux Support by project |
| Operating Temperature | 35W TDP Processor: -40°C to 70°C 54~65W TDP Processor: -40°C to 45°C 71~80W TDP Processor: -40°C to 40°C * PassMark BurnInTest: 100% CPU, 2D/3D Graphics (without thermal throttling) * With extended temperature peripherals; Ambient with air flow According to IEC60068-2-1, IEC60068-2-2, IEC60068-2-14 |
| Storage Temperature | -40°C to 85°C |
| Relative Humidity | 95% RH @ 40°C (Non-condensing) |
| Shock | Operating, 50 Grms, Half-sine 11 ms Duration with SSD, according to IEC60068-2-27 |
| Vibration | Operating, 5 Grms, 5-500 Hz, 3 Axes with SSD, according to IEC60068-2-64 |
| EMC | CE, FCC Class A |
| Safety | LVD (EN60950-1) , Pending |
| Railway | EN50155, EN50121-3-2 |
| In-Vehicle | E-Mark (E13) , Pending |
| MTBF | 407,391 Hours (Database: Telcordia SR-332 Issue3, Method 1, Case 3) |
Varianten
DX-1100-R10
Performance,Compact and Modular Rugged W 8th Generation Intel® Xeon® or Core™ Processors