TANK-870e-H110
Lüfterloser Embedded PC mit 6. Gen. Intel® Core™-Prozessor und 4 GB DDR4 RAM vorinstalliert (erweiterbar bis max. 32 GB). Die Betriebstemperatur liegt zwischen -20°C und 50°C. Die Abmessungen betragen 132,6 x 255,2 x 190 mm. Displays werden mit VGA und HDMI 1.4 angeschlossen. Netzwerkanbindung über GbE LAN und optional WLAN. Schnittstellen sind USB 3.0 und RS-232/422/485. Massenspeicheranbindung mit 2,5-Zoll SATA HDD/SSD. Erweitern lässt sich der Embedded PC über drei Slots mit Mini-PCIe, PCIe und PCI. Als Befestigungsoption ist Wandmontage und DIN-Rail möglich. Die Eingangsspannung liegt zwischen 9 und 36 VDC.
- 6th Gen Intel® Core processor platform with Intel® H110 chipset and DDR4 memory
- Support dual display VGA + HDMI
- On-board internal power connector for providing power to add-on cards
- Great flexibility for hardware expansion
Hauptmerkmale
Spezifikationen| Chassis Color | Dark silver purple + Silver |
| Chassis Dimensions(WxDxH) | 132.6 x 255.2 x 190 mm |
| System Fan | Fanless |
| Chassis Construction | Extruded aluminum alloys |
| Motherboard CPU | Intel® Core i7-6700TE (2.4 GHz, quad-core, TDP=35) Intel® Core i5-6500TE (2.3 GHz, quad-core, TDP=35) |
| Chipset | Intel® H110 |
| System Memory | 2 x 260-pin DDR4 SO-DIMM one 4 GB pre-installed (system max: 32GB) |
| Storage | Hard Drive 1 x 2.5" SATA 6Gb/s HDD/SSD bay |
| I/O Interfaces | 4x USB 3.0 2 x RJ-45 PCIe GbE by RTL8111G controller 2 x RS-232/422/485 (DB-9 w/2.5KV isolation protection) 1 x VGA (up to 1920 x 1200@60Hz) 1 x HDMI 1.4 (upt to 4096 x 2160@24Hz) 1 x Line-out 1 x Mic-in 1 x 802.11b/g/n (optional) |
| Expansions Backplane | 3A: 1 x PCIe x16 2 x PCI 3B: 1 x PCIe x16 1 x PCIe x4 1 x PCI 3C: 3 x PCI |
| Expansions PCIe Mini | 1 x Full-size PCIe Mini slot 1 x Full-size PCIe Mini slot (supports mSATA, colay with SATA) |
| Power input | DC Jack 9 V ~ 36 V DC |
| Power Consumption | 19 V@3.44 A (Intel® Core i7-6700TE with 8 GB memory) |
| Internal Power Connector | 5V@3A or 12V@3A |
| Mounting | Wall mount & Din Rail |
| Operating Temperature | -20°C ~ 50°C with air flow (SSD) 10% ~ 95%, non-condensing |
| Storage Temperature | -40ºC ~ 85ºC with air flow (SSD) 5% ~ 90%, non-condensing |
| Operating Shock | Half-sine wave shock 5G, 11ms 100 shocks per axis |
| Non-Operating Shock | Half-sine wave shock 15G, 11ms 100 shocks per axis |
| Operating Vibration | MIL-STD-810G 514.6C-1 (with SSD) |
| Non-Operation Vibration | Half-sind mode IEC-60068-2-06 |
| Weight (Net/Gross) | 4.2 kg/6.3 kg |
| Safety/EMC | CE/FCC |
| Supported OS | Microsoft® Windows® 8 Embedded Microsoft® Windows® Embedded Standard 7 E Microsoft® Windows® 10 IoT Enterprise |
Varianten
TANK-870e-H110-i7/4G/3C-R11
Ruggedized fanless embedded system with Intel® Core™ i7-6700TE 2.4 GHz (up to 3.4 GHz, quad core, TDP 35W), 4GB DDR4 pre-installed memory, 3 x PCI expansion, VGA/HDMI, 9 ~ 36V DC, RoHS
TANK-870e-H110-i7/4G/3B-R11
Ruggedized fanless embedded system with Intel® Core i7-6700TE 2.4GHz, (up to 3.4 GHz, quad core, TDP 35W), 4GB DDR4 pre-installed memory, 1x PCIe by 16 & 1 x PCIe by 1 & 1 x PCI expansion, VGA/HDMI, 9 ~ 36V DC, RoHS
TANK-870e-H110-i7/4G/3A-R11
Ruggedized fanless embedded system with Intel® Core i7-6700TE 2.4GHz, (up to 3.4 GHz, quad core, TDP 35W), 4GB DDR4 pre-installed memory, 1x PCIe by 16 & 2 x PCI expansion, VGA/HDMI, 9 ~ 36V DC, RoHS
TANK-870e-H110-i5/4G/3C-R11
Ruggedized fanless embedded system with Intel® Core™ i5-6500TE 2.3 GHz (up to 3.3 GHz, quad core, TDP 35W), 4GB DDR4 pre-installed memory, 3 x PCI expansion, VGA/HDMI, 9 ~ 36V DC, RoHS
TANK-870e-H110-i5/4G/3B-R11
Ruggedized fanless embedded system with Intel® Core i5-6500TE 2.3GHz, (up to 3.3 GHz, quad core, TDP 35W), 4GB DDR4 pre-installed memory, 1x PCIe by 16 & 1 x PCIe by 1 & 1 x PCI expansion, VGA/HDMI, 9 ~ 36V DC, RoHS
TANK-870e-H110-i5/4G/3A-R11
Ruggedized fanless embedded system with Intel® Core i5-6500TE 2.3GHz, (up to 3.3 GHz, quad core, TDP 35W), 4GB DDR4 pre-installed memory, 1x PCIe by 16 & 2 x PCI expansion, VGA/HDMI, 9 ~ 36V DC, RoHS
TANK-870e-H110-i7/4G/3C-R10
Ruggedized fanless embedded system with Intel® Core i7-6700TE 2.4GHz (up to 3.4 GHz, Quad Core, TDP 35W), 4GB DDR4 pre-installed memory, 3x PCI expansion, VGA/HDMI, 9~36V DC, RoHS
TANK-870e-H110-i7/4G/3B-R10
Ruggedized fanless embedded system with Intel® Core i7-6700TE 2.4GHz (up to 3.4 GHz, Quad Core, TDP 35W), 4GB DDR4 pre-installed memory, 1x PCI and 2 x PCIe by 1 expansion, VGA/HDMI, 9~36V DC, RoHS
TANK-870e-H110-i7/4G/3A-R10
Ruggedized fanless embedded system with Intel® Core i7-6700TE 2.4GHz (up to 3.4 GHz, Quad Core, TDP 35W), 4GB DDR4 pre-installed memory, 2x PCI and 1 x PCIe by x16 expansion, VGA/HDMI, 9~36V DC, RoHS
TANK-870e-H110-i5/4G/3C-R10
Ruggedized fanless embedded system with Intel® Core i5-6500TE 2.3GHz (up to 3.3 GHz, Quad Core, TDP 35W), 4GB DDR4 pre-installed memory, 3x PCI expansion, VGA/HDMI, 9~36V DC, RoHS
TANK-870e-H110-i5/4G/3B-R10
Ruggedized fanless embedded system with Intel® Core i5-6500TE 2.3GHz (up to 3.3 GHz, Quad Core, TDP 35W), 4GB DDR4 pre-installed memory, 1x PCI and 2 x PCIe by 1 expansion, VGA/HDMI, 9~36V DC, RoHS
TANK-870e-H110-i5/4G/3A-R10
Ruggedized fanless embedded system with Intel® Core i5-6500TE 2.3GHz (up to 3.3 GHz, Quad Core, TDP 35W), 4GB DDR4 pre-installed memory, 2x PCI and 1 x PCIe by 1 expansion, VGA/HDMI, 9~36V DC, RoHS